Mechanical Engineer, Electronics Packaging & RF Components

Astranis  · San Francisco  · Oct 12, 2026
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Astranis builds advanced satellites for high orbits, expanding humanity’s reach into the solar system. Today Astranis satellites provide dedicated, secure networks to highly-sophisticated customers across the globe – large enterprises, sovereign governments, and the US military. With five satellites on orbit and many more set to launch soon, the company is servicing a backlog of more than $1 billion of commercial contracts. Astranis is the preferred satellite communications partner for buyers with stringent requirements for uptime, data security, network visibility, and customization. Astranis has raised over $1.2 billion from some of the world’s best investors, including Andreessen Horowitz, Baillie Gifford, Blackrock, Fidelity, Franklin Templeton, and Snowpoint, and employs a team of 500 engineers and entrepreneurs. Astranis designs, builds, and operates its satellites out of its 153,000 sq. ft. headquarters in Northern California, USA. Mechanical Engineer, Electronics Packaging & RF Components

Requirements:
• Design, analyze, build, and test space-grade electronics enclosures, RF housings, and PCBA mounts.
• Implement effective RF isolation and EMI shielding techniques, including gasketing, cavity design, and precision machining interface controls.
• Integrate electronics units into the spacecraft design, developing procedures to optimize assembly, wire routing, and thermal interface material application.
• B.S. or M.S in mechanical, aerospace engineering or equivalent
• 2+ years of experience in mechanical design with a focus on electronics packaging, RF packaging, or enclosure design.
• Proficiency in mechanical 3D CAD (e.g., SolidWorks, NX, or Creo).
• Strong fundamentals in mechanical design, structural design, and thermal management for printed circuit board assemblies (PCBAs) and their enclosures.
• Practical knowledge of RF isolation techniques and EMI/EMC mitigation strategies in mechanical enclosures.
• Experience with GD&T, tolerance analysis, engineering drawings, and design for manufacturability.
• Hands-on experience with hardware prototyping, thermal interface materials, precision machining, and assembly processes.
• Don't meet them all? Not a problem. Please apply even if you do not meet all these criteria.
• Experience designing high-frequency (Ku-Band or higher) RF/microwave enclosures, waveguides, or filter housings.
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Company
Astranis
Location
San Francisco
Job Type
Full-time
Category
RF / Microwave
Posted
Oct 12, 2026
Source
Original posting ↗
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